Vespel SCP-5050 — Properties, Datasheet & Alternatives
DuPont · PI · Polyimide for semiconductor CMP retaining rings
Alternatives to Vespel SCP-5050 — same family, same reinforcement
- P84 NT — Evonik · PI
- P84 NT Fiber — Evonik · PI
- Vespel SP-1 — DuPont · PI
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Technical Properties
| Density | 1.45 g/cm³ |
| Melt Volume Rate (MVR) | no data |
| Tensile Strength | 80 MPa |
| Elongation at Break | 5 % |
| Flexural Modulus | no data |
| Impact Strength (Charpy) | no data |
| HDT (1.8 MPa) | 360 °C |
| Vicat Softening Temp | no data |
| Processing | direct forming, machining |
Typical Applications
- CMP retaining rings
- wafer handling
- semiconductor
Data compiled from publicly available technical datasheets. Values are typical, not guaranteed specifications. Always verify with the supplier's current TDS.